| Core Components | Specification Parameters |
|---|
| CPU | RK3568, quad-core 64-bit Cortex-A55, with a maximum main frequency of 1.8GHz |
| GPU | ARM G52 2EE, supporting OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1, and featuring a built-in high-performance 2D acceleration hardware |
| Memory | LPDDR4X 1GB/2GB (default)/4GB/8GB |
| Flash Storage | EMMC 8G (default)/16G/32G/64G/128GB (optional) |
| Storage Expansion | Supports up to 128GB TF card expansion |
| Display Interfaces | Specification Parameters |
| HDMI OUT Interface | HDMI2.0, with a maximum support for 3840*2160 output |
| LVD0/EDP1 Interface | Double-row pin J3 (DIP30/20Pin2.0mm pitch). Through hardware modification, it can be selected for LVDS or EDP display output, with a maximum supported resolution of 19201080. a. When LVDS0 display output is selected, it is the main screen interface. b. When EDP1 display output is selected, it is the secondary screen interface. |
| LVDS1/ED0 Interface | Double-row pin J61 (DIP30/20Pin2.0mm pitch). Through hardware modification, it can be selected for LVDS or EDP display output, with a maximum supported resolution of 19201080. a. When LVDS1 display output is selected, it is the secondary screen interface. b. When EDP0 display output is selected and the double-row pin J3 (LVDS0/EDP1) interface selects EDP1 display output, it is the main screen interface. c. When EDP0 display output is selected and the double-row pin J3 (LVDS0/EDP1) interface selects LVDS0 display output, it is the secondary screen interface. |
| Audio Interfaces | Specification Parameters |
| Headphone Jack Interface | 1-way microphone mono input (analog signal input), 1-way audio stereo output (analog signal output) |
| Power Amplifier Interface | Left and right stereo output, supporting 8Ω 10W dual speakers |
| Microphone Interface | 1-way microphone mono input (analog signal input) |
| Network Support | Specification Parameters |
| Ethernet | 1 standard RJ45 interface, 1 2.0mm - 4P socket, 10/100/1000M adaptive Ethernet |
| WIFI/Bluetooth | Onboard WIFI/BT module, supporting 2.4GHz/5GHz dual-band WiFi6 (optional), 802.11a/b/g/n/ac protocols, and Bluetooth 4.0 (supporting BLE) |
| Mobile Network | 1 built-in MINI PCIE socket slot for expanding and connecting 3G/4G modules |
| Basic Interfaces | Specification Parameters |
| USB | 1 standard USB3.0 interface, 7 USB2.0 interfaces (including 1 external standard USB2.0 socket and 6 2.0mm - 4P sockets), used to connect external high-definition USB cameras, USB flash drives, keyboards, mice and other devices |
| USB OTG | 1 USB OTG interface (standard USB3.0 socket), used for system debugging, firmware update, and can also be set to Host mode |
| Serial Ports | 4 serial ports, among which 3 are TTL (2 can be optionally configured as RS232 serial ports, 1 can be optionally configured as RS485 serial ports), and 1 is a TTL debug serial port |
| GPIO Pins | 5 IO pins, supporting input and output operations |
| Onboard RTC | Supports real-time clock, powered by a 1220 coin cell battery |
| IIC Interface | 1 standard I2C interface, which can be used for touch and communication |
| Timed Power On/Off | Optional |
| Hardware Watchdog | Optional |
| Infrared Receiver | Optional |
| Infrared Remote Power On | Optional |
| Others | Specification Parameters |
| Operating System | Android 11 (default) |
| Power Socket | 1 external DC12V input socket (DC - 5.5×2.5MM female socket), 1 2.54mm - 6P input socket |
| Recommended Power Specification | 12V 2 - 5A (selected according to the power of peripheral devices) |
| System Upgrade | Supports PC/USB flash drive/TF card upgrades |
| Working Environment | Specification Parameters |
| Operating Temperature | 0℃～70℃, recommended 5℃～35℃ |
| Operating Humidity | 10％～90％, without condensation |
| Storage Temperature | -30℃～75℃, recommended to store at room temperature |